Julian Hoffmann, M.Sc

  • Karlsruhe Institute of Technology (KIT)
    Institute for Automation and Applied Informatics (IAI)

    Hermann-von-Helmholtz-Platz 1
    76344 Eggenstein-Leopoldshafen

    Fax: +49 721 608 22602
    Building-No.: 445 / 449 / 668


Siloxane-functionalised surface patterns as templates for the ordered deposition of thin lamellar objects.
Hoffmann, J.; Gamboa, S. M.; Hofmann, A.; Gliemann, H.; Welle, A.; Wacker, I.; Schröder, R. R.; Ness, L.; Hagenmeyer, V.; Gengenbach, U.
2019. Scientific reports, 9 (1), Article no: 17952. doi:10.1038/s41598-019-54507-1
Multi-Chip Integration by Photonic Wire Bonding: Connecting Surface and Edge Emitting Lasers to Silicon Chips.
Hoose, T.; Billah, M.; Marin, P.; Blaicher, M.; Dietrich, P. I.; Hofmann, A.; Troppenz, U.; Möhrle, M.; Lindenmann, N.; Thiel, M.; Simon, P.; Hoffmann, J.; Goedecke, M. L.; Freude, W.; Koos, C.
2016. OSA Technical Digest: Optical Fiber Communication Conference, Anaheim, California, March 20-22,2016, Art.Nr. 7537230, The Optical Society of America (OSA). doi:10.1364/OFC.2016.M2I.7