Institute for Automation and Applied Informatics

System Integration in Micro- and Nanotechnology I

Notes

Content:

  • Introduction to system integration (fundamentals)

  • Brief introduction to MEMS processes

  • Flexures

  • Surfaces and plasma processes for surface treatment

  • Adhesive bonding in engineering

  • Mounting techniques in electronics

  • Molded Interconnect devices (MID)

  • Functional Printing

  • Low temperature cofired ceramics in system integration 

  • 3D-Integration in semiconductor technology

Learning objectives:

The students acquire basic knowledge of challenges and system integration technologies from mechanical engineering, precision engineering and electronics.

Language of instructionDeutsch
Bibliography
  • A. Risse, Fertigungsverfahren der Mechatronik, Feinwerk- und Präzisionsgerätetechnik, Vieweg+Teubner Verlag Wiesbaden, 2012
  • M. Madou, Fundamentals of microfabrication and nanotechnology, CRC Press Boca raton, 2012
  • G. Habenicht, Kleben Grundlagen, Technologien, Anwendungen, Springer-Verlag Berlin Heidelberg, 2009
  • J. Franke, Räumliche elektronische Baugruppen (3D-MID), Carl Hanser-Verlag München, 2013
Aim

Students acquire fundamental knowledge about challenges and system integration processes.