Content:

• Introduction to system integration (fundamentals)

• Brief introduction to MEMS processes

• Flexures

• Surfaces and plasma processes for surface treatment

• Adhesive bonding in engineering

• Mounting techniques in electronics

• Molded Interconnect devices (MID)

• Functional Printing

• Low temperature cofired ceramics in system integration 

• 3D-Integration in semiconductor technology

Learning objectives:

The students acquire basic knowledge of challenges and system integration technologies from mechanical engineering, precision engineering and electronics.

• A. Risse, Fertigungsverfahren der Mechatronik, Feinwerk- und Präzisionsgerätetechnik, Vieweg+Teubner Verlag, Wiesbaden, 2012
• M. Madou, Fundamentals of microfabrication and nanotechnology, CRC Press Boca Raton, 2012
• G. Habenicht, Kleben Grundlagen, Technologien, Anwendungen, Springer-Verlag Berlin Heidelberg, 2009
• J. Franke, Räumliche elektronische Baugruppen (3D-MID), Carl Hanser-Verlag München, 2013